"Quality First" has always been Cistron Electronics’ motto in customer service. We think what our customer thinks. Not only the parts are delivered in time, but also the quality - customers will rest assured that their output is in highest level of quality since we not only bear in mind, but strictly enforce the quality control process

We guarantee that all the electronic components we supply to you are authentic parts of original manufacturers’ packing. Of all the components we supply to you, we offer a free RMA period of one month on shipment date, if you can find any quality defects. That is, should any quality defects situation occur, we guarantee to recall the parts we have supplied to you at the original cost of your orders.

The strict quality inspection process is the core part of Cistron Electronics’ quality control system. In order to meet customer demands of "Reassuring Purchasing and Using" of the products, we develop detailed inspection processes to ensure effective and efficient implementation. We have advanced testing processes, professional testing equipment, experienced IQC engineers, which are the most important factors; professional and responsible working attitude, which can ensure our customers of world-class quality goods.

Our trained engineers use a state of the art, multi-step inspection detection process to identify counterfeit and cloned products. The process begins with analyzing the shipping and packaging. It continues with the parts undergoing several levels of inspection including: marking and dimension checks, internal visual analysis, material analysis and electrical testing to insure the safety of the production.

Inspection of external and internal packing
Inspection of part number, date code, package, quantity
Inspection of RoHS status
Label comparison with picture library
IC marking comparison with picture library
RoHS test
Measuring of the physical dimensions of the component
Inspection of the condition of the pins or balls for the component
Key parameters test for common component (such as passive components, diode and transistor)
Inspection of the inside bond arrangement of the die via X-Ray equipment
Baking and re-vacuuming
Test by our QC partner if further inspection needed